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Characterization of integrated circu...

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McKenna, Robert G.

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Characterization of integrated circuit packaging materials /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Characterization of integrated circuit packaging materials // editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick.
other author:	McKenna, Robert G.
Published:	Boston :Butterworth-Heinemann, : c1993.,
Description:	xviii, 274 p. :ill. ;24 cm.
Series:	Materials characterization series
Subject:	Electronic packaging - Materials. -
ISBN:	0750692677

Characterization of integrated circuit packaging materials /
Characterization of integrated circuit packaging materials /editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick. - Boston :Butterworth-Heinemann,c1993. - xviii, 274 p. :ill. ;24 cm. - Materials characterization series.

Includes bibliographical references and index.

ISBN: 0750692677

LCCN: 93007685Subjects--Topical Terms:

669442
Electronic packaging
--Materials.

LC Class. No.: TK7870.15 / .C52 1993

Dewey Class. No.: 621.381/046

Characterization of integrated circuit packaging materials /
LDR:00664nam a2200193 a 45 001 652355
003 DLC
005 19931015080221.6
008 930317s1993 maua b 001 0 eng
010 $a 93007685
020 $a 0750692677
035 $a dt 00012592
040 $a DLC $c DLC $d DLC
050 0 0 $a TK7870.15 $b .C52 1993
082 0 0 $a 621.381/046 $2 20
245 0 0 $a Characterization of integrated circuit packaging materials / $c editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick.
260 $a Boston : $c c1993. $b Butterworth-Heinemann,
300 $a xviii, 274 p. : $b ill. ; $c 24 cm.
440 0 $a Materials characterization series
504 $a Includes bibliographical references and index.
650 $a Electronic packaging $x Materials. $3 669442
650 $a Integrated circuits $x Design and construction. $3 658490
700 $a McKenna, Robert G. $3 669440
700 $a Moore, Thomas M. $3 669441

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W0024781

六樓西文書區HC-Z(6F Western Language Books)

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TK7870.15 C469 1993

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